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  page 1 formosa ms sfm11-mh1 thru sfm18-mh1 1 2 2 2 2 3 4 4 4 5 6 6 7 list list................................................................................................. package outline............................................................................... features.......................................................................................... maximum ratings ............................................................................. rating and characteristic curves........................................................ pinning information........................................................................... marking........................................................................................... suggested solder pad layout............................................................. packing information.......................................................................... reel packing.................................................................................... suggested thermal profiles for soldering processes............................. high reliability test capabilities........................................................... mechanical data............................................................................... http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. ds-121460 2014/01/20 - a 7 chip super fast rectifiers
page 2 formosa ms batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. low profile surface mounted application in order to optimize board space.. high current capability. high surge current capability. glass passivated chip junction. features iny plastic smd package. lead-free parts meet rohs requirments. ? super fast reovery time for switching mode application. ? suffix "-h" indicates halogen free parts, ex. sfm11-mh1-h. ? ? ? ? ? ? ? t 1.0a surface mount super fast rectifiers-50-600v http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. note 1. reverse recovery time test condition, i =0.5a, i =1.0a, i =0.25a 2. frrr measured at 1 mhz and applied reverse voltage of 4.0 vdc maximum ratings and electrical characteristics (at t =25 a o c unless otherwise noted) sfm11-mh1 symbols maximum repetitive peak reverse voltage parameter sfm12-mh1 sfm13-mh1 sfm14-mh1 sfm15-mh1 SFM16-MH1 sfm17-mh1 sfm18-mh1 maximum rms voltage peak forward surge current 8.3ms single half sine-wave(jedec method) maximum dc blocking voltage maximum average forward rectified current i o v dc v rrm i fsm v rms maximum forward voltage at i =1.0a f v f i r maximum dc reverse current t =25 c at rated dc blocking voltage t =125 c j j c j typical junction capacitance (note 2) t stg t j operating junction temperature range storage temperature range maximum reverse recovery time (note 1) t rr 50 35 50 100 70 100 150 105 150 200 140 200 300 210 300 400 280 400 500 350 500 600 420 600 1.0 25 5.0 100 0.95 1.25 1.70 10 35 -55 to +150 -55 to +150 unit v v v a a v ua ua pf ns c c mechanical data epoxy : ul94-v0 rated flame retardant case : molded plastic, terminals :plated terminals, solderable per mil-std-750, method 2026 polarity : indicated by cathode band mounting position : any ? ? ? ? ? ? sod-123h1 weight : approximated 0.0103 gram sfm11-mh1 thru sfm18-mh1 ds-121460 2014/01/20 - a 7 package outline dimensions in inches and (millimeters) sod-123h1 0.031(0.8) typ. 0.146(3.7) 0.130(3.3) 0.004(0.1) typ. 0.031(0.8) typ. 0.012(0.3) typ. 0.071(1.8) 0.056(1.4) 0.040(1.0) 0.024(0.6) chip super fast rectifiers
page 3 .4 .6 .8 1.0 1.2 1.4 .001 .01 .1 1.0 10 rating and characteristic curves (sfm11-mh1 thru sfm18-mh1) fig.1-typical forward characteristics fig.5-typical junction capacitance instantaneous for ward current ,(a) forward voltage,(v) pulse width 300us 1% duty cycle (+) (+) 25vdc (approx.) ( ) ( ) pulse generator (note 2) oscilliscope (note 1) 1 non- inductive  notes: 1. rise time= 7ns max., input impedance= 1 megohm.22pf. 2. rise time= 10ns max., source impedance= 50 ohms. +0.5a 0 -0.25a -1.0a | | | | | | | | 1cm set time base for 50 / 10ns / cm trr d.u.t. fig.3- test circuit diagram and reverse recovery time characteristics 10 noninductive 50 noninductive   t =25 c j fig.2-typical forward current average for ward current ,(a) 0.2 0.4 0.6 0.8 1.0 1.2 derating curve lead temperature ( c) 1.6 1.8 sfm15-mh1~SFM16-MH1 sfm11-mh1~sfm14-mh1 reverse voltage,(v) junction cap acitance,(pf) 70 60 50 40 30 20 10 0 .01 .05 .1 .5 1 5 10 50 100 0 25 50 75 100 125 150 175 0 fig.4-maximum non-repetitive forward surge current sfm17-mh1~sfm18-mh1 http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. peak for waard surge current ,(a) number of cycles at 60hz 10 0 20 30 40 50 110 5 50 100 t =25 c j 8.3ms single half sine wave jedec method p.c.b. mounted on 0.2"x0.2" (5.0 mm x 5.0 mm) copper pad areas ds-121460 2014/01/20 - a 7
pinning information 1 2 pin1 cathode pin2 anode pin simplified outline symbol suggested solder pad layout dimensions in inches and (millimeters) a c b b 0.051 (1.30) a 0.071 (1.80) c 0.067 (1.70) package sod-123h1 page 4 formosa ms marking type number marking code sfm11-mh1 s1 sfm12-mh1 s2 sfm13-mh1 s3 sfm14-mh1 s4 sfm15-mh1 s5 SFM16-MH1 s6 sfm17-mh1 s7 sfm18-mh1 s8 http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. 2 1 sfm11-mh1 thru sfm18-mh1 ds-121460 2014/01/20 - a 7 chip super fast rectifiers
page 5 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. packing information p 0 p 1 e b d f w p a d d 1 d 2 w 1 c t unit:mm note:devices are packed in accor dance with eia standar rs-481-a and specifications listed above. item tolerance sod-123h1 carrier width carrier length carrier depth sprocket hole 13" reel outside diameter 7" reel outside diameter 13" reel inner diameter 7" reel inner diameter feed hole diameter sprocket hole position punch hole position punch hole pitch sprocket hole pitch embossment center reel width overall tape thickness tape width p 0 p 1 e b c d f t w p a d d d 1 d 1 d 2 w 1 symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 1.50 - 178.00 - 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 2.00 3.85 1.10 sfm11-mh1 thru sfm18-mh1 ds-121460 2014/01/20 - a 7 chip super fast rectifiers
page 6 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. sfm11-mh1 thru sfm18-mh1 reel packing sod-123h1 7" 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 8.5 package reel size reel component spacing box inner box reel dia, carton size carton approx. gross weight (kg) (pcs) (m/m) (m/m) (m/m) (pcs) (m/m) (pcs) profile feature soldering condition average ramp-up rate(t to t ) <3 /sec preheat -temperature min(tsmin) 150 -temperature max(tsmax) 200 -time(min to max)(t ) 60~120sec tsmax to t -ramp-uprate <3 /sec time maintained above: -temperature(t ) 217 -time(t ) 60~260sec peak temperature(t ) 255 0/ 5 time within 5 of actual peak temperature(t ) ramp-down rate <6 /sec time 25 to peak temperature <6minutes lp s l l l p p o o o o o oo o o o c c c c c c- + c c c c 3.reflow soldering 10~30sec 1.storage environment: temperature=5 ~40 humidity=55%25% 2.reflow soldering of surface-mount devices oo cc suggested thermal profiles for soldering processes critical zone tl to tp critical zone tl to tp tl tsmax tsmin ramp-up tp ts preheat t25 c to peak o time 25 tl tp ramp-down temperature ds-121460 2014/01/20 - a 7 chip super fast rectifiers
page 7 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. sfm11-mh1 thru sfm18-mh1 ds-121460 2014/01/20 - a 7 1. solder resistance 2. solderability 3. high temperature reverse bias 4. forward operation life 5. intermittent operation life 6. pressure cooker 7. temperature cycling 8. forward surge 9. humidity 10. high temperature storage life at 260 5 for 10 2sec. immerse body into solder 1/16" 1/32" at 245 5 for 5 sec. v =80% rate at t =150 for 168 hrs. rated average rectifier current at t =25 for 500hrs. t = 25 c, i = i on state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. 15p at t =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. 8.3ms single half sine-wave , one surge. at t =85 , rh=85% for 1000hrs. at 175 for 1000 hrs. c c c c c cc c c o o o o o oo o o rj a afo sig a a o mil-std-750d method-2031 mil-std-202f method-208 mil-std-750d method-1038 mil-std-750d method-1027 mil-std-750d method-1036 mil-std-750d method-1051 mil-std-750d method-4066-2 mil-std-750d method-1021 mil-std-750d method-1031 jesd22-a102 item test conditions reference high reliability test capabilities chip super fast rectifiers


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